X-RAY DIFFUSE SCATTERING FROM OXYGEN-BASED DEFECTS IN CZOCHRALSKI SILICON

 

P. Klang1 , V. Holư1,2

 

1Institute of Condensed Matter Physics, Masaryk University, Brno, Czech Republic

2Faculty of Mathematics and Physics, Charles University, Prague, Czech Republic

klang@physics.muni.cz

 

Silicon single crystals grown by the Czochralski method contain oxygen impurities in the concentration of about 1018 cm-3. Annealing at high temperatures leads to the formation of amorphous SiO2 precipitates, which create traps for fast diffusing metallic contaminants [1]. The understanding of the formation and growth of these oxygen-based defects plays an important role in fabrication of integrated circuits.

Czochralski grown silicon wafers (111) were studied using triple-axis high resolution X-ray diffraction. We have measured reciprocal space maps of intensity distribution from the scattering on defects in silicon wafers after annealing processes (see Fig. 1(a)). The samples were annealed at 1000 °C for different periods in order to study the growth of oxygen-based defects. In the radial cross-section of the measured map we can find different types of scattering - Huang scattering (HS) for small q, Stokes-Wilson scattering (SWS) for middle q and thermal diffuse scattering (TDS) for large q (see Fig. 1(b)).

 

Figure 1. (a) Measured symmetrical reciprocal space map (111) of the sample annealed at 1000 °C for a period of 16 h, (b) radial cross-section of this map along the qx direction with the different types of the scattering.

 

We have also modelled the reciprocal space maps of intensity distribution using the Krivoglaz theory [2] and a continuum model of the defect deformation field. From the comparison, we have determined the size, symmetry and concentration of the defects, as well as the deformation field in their neighbourhood.

 

References

1.     C. Newman, J.Phys.: Condens. Matter 12, (2000), R335

2.     M. A. Krivoglaz in Diffraction of X-rays and Neutron in Nonideal Crystals (Springer, Berlin), 1996